|
Redfish
Photonics, Inc.
5460 Skylane Blvd.,
Santa Rosa, Ca 95403
Phone: (707)545-9800 .
Fax: (707)545-9801
© 2003 Redfish Photonics, Inc.
All rights reserved.
| |
Operating Precautions
 Print Friendly Click Here
Applied Current: Do
not exceed current limits
- Heat caused by excessive
current can melt solder joints and bismuth telluride material.
- Exceeding current limits
can initially result in thermal turn-around. If this condition exists the
current should be reduced until temperature stability is achieved. Note: If
the applied current is less than the published value, reference mounting
instructions for verification of proper thermal conductivity between
components and heat load precautions.
Ensure correct electrical
connections
- In applications where the
heat pump is used as a cooling device, correct polarity of power is critical.
Should reverse (negative) current be applied, the device will function as a
heater and may overheat the component mounted on the top side of the heat pump
causing permanent damage to the heat pump or component mounted on the heat
pump.
Condensation
-
When operated below the dew
point, condensation within the heat pump device can cause shorting of
thermocouples and wires. Ensure that heat pump is properly enclosed in a dry
gas or vacuum enclosure during operation.
Heat Load
The primary factor contributing to heat load is the material being cooled
(mounted on the top side of the heat pump). This is referred to as the active
load. Subtle (passive) environmental factors such as air and fluid surrounding
the heat pump can also contribute to heat load.
- If excessive active
loading exists on the cold side of the heat pump it may exhibit thermal
turn-around. In this event a heat pump with a larger surface top ceramic (cold
side) may be required.
Temperature Control
- Noise or ripple from the
temperature controller or power line will degrade the performance of the heat
pump.
- To attain optimum
temperature control, mount a thermistor in as close proximity to the device
being cooled as possible and include it in a proper control circuit.
Heat Dissipation
- Without proper heat
dissipation of the package the heat pump will not achieve optimum performance
and can be permanently damaged.
- A heatsink of 0.25 inches
thick copper (or other equivalent thermally conductive material), securely
attached to the hotside of heat pump assembly will ensure proper heat
dissipation. While aluminum material is used for some applications, it is not
as efficient as copper, particularly with larger SSHP's. The heatsink material
must be large enough to dissipate two times the heat potential at the hot side
of the SSHP and should be cooled by forced air or liquid circulation through
the heatsink.
- The junction between the
heat pump assembly and heatsink should be secured with a thin layer of
thermally conductive material such as thermal grease. Thermal pads are not
recommended as they have been found to be less efficient than thermal grease.
Ensure that there are no voids in the material and that the heat pump assembly
is securely fastened into place.
Power Requirements
- The amount of power
required will vary with the design of the module and its system application.
Typical power requirements for standard modules are defined in the charts
below. The definitions of configurations for each model can be found in the
Product Specifications. For application specific designs and power
requirements please contact Redfish Photonics.
- Power may be controlled
through manual or automatic means. There are many thermistors, temperature
controllers, and circuit designs used to control temperature and maintain
stability of the SSHP. Redfish Photonics staff can help match the appropriate
means of temperature control with your SSHP to achieve a system design that
will optimize the performance of your SSHP. Please contact us with your
questions.
|
MC 1000
Series Solid-State Heat Pumps |
|
Model |
I Max
Amps |
Q Max
Watts |
V Max
Volts |
∆T
Max
Dry N2
TH=27șC |
|
1000
Series, 1-stage cascade solid state heat pumps |
|
1001 |
1.8 |
0.9 |
0.8 |
79 |
|
1002 |
1.8 |
2.1 |
2.0 |
80 |
|
1003 |
1.8 |
9.0 |
8.0 |
80 |
|
1004 |
1.0 |
1.2 |
1.9 |
|
|
1005 |
1.0 |
2.2 |
3.6 |
|
|
1006 |
0.0 |
2.7 |
4.5 |
|
|
1007 |
1.6 |
3.1 |
3.6 |
|
|
1008 |
2.0 |
4.0 |
3.6 |
|
|
1009 |
1.9 |
0.9 |
0.8 |
|
|
MCC Series
Cascade solid-state heat pumps |
|
Model |
I Max
Amps |
Q Max
Watts |
V Max
Volts |
∆T
Max
Dry N2
TH=27șC |
∆T
Max
Vacuum
TH=27șC |
|
2000 Series, 2-stage cascade
solid state heat pumps |
|
2001 |
1.4 |
0.4 |
0.8 |
79 |
|
|
2002 |
1.4 |
0.6 |
2.0 |
80 |
|
|
2003 |
1.2 |
2.4 |
5.4 |
80 |
|
|
3000 Series, 3-stage cascade
solid state heat pumps |
|
3001 |
1.4 |
0.4 |
1.9 |
|
110 |
|
3002 |
1.3 |
0.7 |
3.4 |
|
109 |
|
3003 |
0.9 |
0.9 |
7.6 |
|
110 |
|
4000 Series, 4-stage cascade
solid state heat pumps |
|
4001 |
2.4 |
0.7 |
6.3 |
|
129 |
|
4002 |
2.1 |
1.1 |
6.3 |
|
121 |
|
4003 |
3.1 |
1.6 |
6.3 |
|
120 |
| |
|
Thanks for Visiting Us
IN 2008
Photonics
West
Jan 22-24
San Jose, California
PITTCON
March 3-5
New Orleans, Louisiana
OFC
February 26-28
San Diego, California
|
|
|
|
