Component Surface Preparation

• The cold plate of the heat pump and the surface of the component being mounted to the cold plate should be prepared by removing dirt, oil, and all other foreign matter. The heat pump surface may be cleaned by using alcohol and a cotton swab.
• To ensure proper heat dissipation, all burrs should be removed from the surface to which the heat pump will be attached. Ensure that gaps caused by small pits and voids are filled with the thermal conductive material used for the interface between the SSHP module and adjoining components.
• It is necessary to ensure that the adjoining surfaces to the SSHP are flat to less than 0.08mm to avoid cracking the micro-pillars or the junction between the pillars and ceramic plates and to ensure an optimum thermal interface.