Component Installation

• Solder or adhesives are used to mount components to the surface of the heat pump.
• Solder provides good thermal conductivity with minimal outgassing. However, migration of solder flux, when used, could degrade the performance of the module and over time destroy the reliability of the assembly. Exercise care to contain solder to the selected area to prevent shorting of packaged components and heat pump.
• Properly selected thermal adhesives can provide a permanent bond, minimal outgassing, and reliability with proper application and curing.
• Proper heat dissipation and optimum performance are achieved when the mounting material is applied in a thin layer without voids.