• Temperature limits
   
  • Avoid using any mounting material that requires the use of temperatures exceeding 175°C (unless a higher rated, nonstandard, solder was used during the manufacturing process). Use of processes exceeding this temperature may result in reflow of SSHP solder and permanent damage to the module.
     
• Surface preparation
   
  • The mounting surface should be prepared by removing dirt, oil and all other foreign matter.
     
  • To ensure proper heat dissipation, all burrs and ticks should be removed.