Selection of mounting material
 

• There are many different materials and processes used in joining semiconductor components together. Only a small number are appropriate for hermetic packages and they require specialized processing to ensure integrity of joints and long-term reliability.
   

  • Solder provides good thermal conductivity with minimal outgassing. However, migration of solder flux onto sensitive components could degrade the performance of your module and over time destroy the reliability of the assembly.
     

  • Properly selected thermal adhesives can provide a truly solid permanent bond, minimal outgassing and reliability with proper application and curing.

Application of mounting material
 

• To ensure proper heat dissipation and optimum performance the mounting material should be evenly applied in a thin layer ensuring that there are no voids. Thermal adhesives require specialized curing processes and should be verified to be compatible with all packaged components.
   

• In the event that solder is used, care should be exercised to ensure that solder is confined to the area of application to prevent shorting of packaged components and to prevent migration of flux onto sensitive components. This can be accomplished through the use of an appropriate cleaning process and proper cleaning solvents.