• Without proper heat dissipation of the packaged device the SSHP will not achieve optimum performance and can be permanently damaged.
• A heatsink of at least 0.25 inches thick copper (or other equivalent thermally conductive material), securely attached to the hotside of the SSHP will ensure proper heat dissipation. While aluminum material is used for some applications, it is not as efficient as copper, particularly with larger SSHP's. The heatsink material must be large enough to dissipate two times the heat potential at hot side of the SSHP and should be cooled by forced air or liquid circulation through the heatsink.
• The junction between the SSHP and heatsink should be secured with a thin layer of material such as thermal grease. Thermal pads are not recommended as they have been found to be less efficient than thermal grease. Ensure that there are no voids in the material and that the SSHP is securely fastened into place.